| Compliant bump service |
| Wafer | 6"、8" silicon |
| Min bump pitch | 22um for in-line pad layout, 15um for staggered pad layout |
| Capacity | 30,000 wafer/month |
| Compliant bump product | |
 |
Incoming Wafer |
 |
UBM Sputtering |
 |
Resist Coating |
 |
Resist Patterning |
 |
Gold Electroplating |
 |
Resist Stripping |
 |
UBM Etching |
| Gold bump product | |
| PI buffer coat & gold bump | |
|
|
| Gold bump | |
|
|
|
|
Rectangular bump shape and flat bump surface for COG application. |
|
|
|
Ultra fine pitch gold bump for FAB process design rule shrinkage. |
|
|
||||||||||
| Compliant bump product | ||||||||||
| Flat surface compliant bump | ||||||||||
|
||||||||||
| Area array cavity surface compliant bump | ||||||||||
|
||||||||||
 HomeAbout UsServicesTechnologyContact UsSitemapCopyright © 2007 FORTUNA TECHNOLOGIES INC. All Rights Reserved • Privacy Policy • |
 |