| Rerouting service |
| Wafer | 6", 8" silicon |
| Min line/space | 20um/20um |
| Dielectrics | Polyimide |
| Metal trace | Plated gold, sputtered Al |
| Service range | Bump mask design, wafer rerouting |
| Allocated capacity | 1,000 wafer/month |
| Rerouting process flow | |
|
Incoming Wafer |
|
Re-passivation |
|
UBM Sputtering |
|
Resist Patterning |
|
Gold Electroplating |
|
Resist Stripping & UBM Etching |
|
Top Passivation & New Pad Definition |
| Rerouting product | |
| Single (or Double) Metal Rerouting | |
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