| Solder bump service (engineering phase) |
| Wafer | 6", 8" silicon |
| Solder material | lead-free in engineering run |
| Solder bump process flow | |
|
Incoming Wafer |
|
UBM Sputtering |
|
Resist Patterning |
|
Cu & Solder Electroplating |
|
Resist Stripping & UBM Etching |
|
Reflow |
| Solder bump product |
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