FORTUNA TECHNOLOGIES INC. was established in December 1996 in Hsinchu Science-based Industrial Park.  It was founded by Mr. JJ Wu and Dr. HW Peng together with several senior technical staffs from ITRI, and became the first driver IC gold bumping and TCP assembly company in Taiwan.  In February 2007, Mr. MS Lee, Chairman of TaiwanOasis Tech., succeeded Mr. JJ Wu as the Chairman.

Through years of technology development and fund raising, now the total capital investment is 35M USD, with customers throughout the flat panel display driver IC industries, including domestic and foreign IC design houses and IDM companies.  The end products were qualified by the leading companies in the display industry such as Samsung, LG Philip, and AUO.

The processes we are providing include gold bumping, multiple contacts circuit probing, TCP/COF assembly and final testing, gold trace RDL, and low temperature gold bumping.

The main driver of our business is the turn-key service for TFT-LCD and CSTN-LCD driver IC backend processing, containing gold bumping, testing, and assembly. 

To cope with the development trend of the multi-channel driver IC, during the recent years, we have co-worked with ITRI in the development of compliant bump technology, which could be applicable in the high pin count and fine pitch driver IC COG assembly

Milestone

• Feb. 1996     Admitted by Management Bureau of HSIP to set up in HSIP
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  Dec. 1996     FuPo Electronics Corp. was approved by the Government to establish.
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  July 1997     Bumping fab construction and process equipment move in.
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  Dec. 1997    Gold bumping and solder bumping process development and pre-production.
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  Sep. 1999    Circuit probing and TCP assembly line set up and pre-production.
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  May 2000    ISO 9001 certified.
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  Aug. 2001    ISO 14001 certified.
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  Aug. 2001    EAQA certified.
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  Jan. 2003    IPO in Hsin-Guei market
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  Dec. 2003    Low temp gold bumping process production for CIS wafers.
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  Jan. 2004    QS 9000 certified.
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  May 2004    COF assembly process production
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  Dec. 2004   IPO in Great-Tai market
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  Jan. 2005    Low temp RDL(for DDR stacked assembly) process production
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  Feb. 2007   Mr. MS Lee succeeded as Chairman of FuPo.
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  Feb. 2007   Compliant bump engineering sample passed RA test.
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  Mar. 2007 Acquired CP & assembly production building at Lishin Rd #2-1, 3F.
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  Mar. 2007 OHSAS 18001 certified