| LCD Driver IC Turnkey Service |
| Fortuna can provide one stop turnkey service for LCD driver IC. From wafer bumping、circuit probing、 to back grind - pick & place - chip tray packing (for COG application), or ILB - potting - marking - final testing (for TCP application). All of these processes are Fortuna's in-house capacity.
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| Gold Bumping | |
| Please refer to gold bump service for details. | |
| Wafer Testing |
| Wafer | 5", 6", 8" silicon |
| Min bump pitch | 25um |
| Test temperature | 25℃ ~ 150℃ |
| Service range | CP programming, probe card design, wafer testing |
| Capacity | 20K wafer/month |
| TCP/COF Assembly |
| Wafer | 5", 6", 8" silicon |
| Min bump pitch | TCP : 40um, COF : 25um |
| Service range | Tape drawing design, product tooling design, assembly |
| Capacity | TCP : 2 KK pcs/month, COF : 4.5 KK pcs/month |
| Final testing |
| Tape width | 35mm, 48mm(W/SW), 70mm (W) |
| Service range | F/T programming, probe card design, push plate design, final test |
| Test temperature | 25℃ ~ 150℃ |
| Capacity | 5KK pcs/month |
Process flow |
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Incoming wafer |
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Wafer bumping |
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CP (Circuit probing) |
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Inking |
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Potting |
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ILB |
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Die saw |
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Grinding |
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Marking |
Pick & Place |
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Packing |
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Final Testing |
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Packing |
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| Product |
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